Semiconductor Packaging

Surface Metrology for Semiconductor Packaging

Next-generation electronic and optical components require increasingly fine surface and geometry inspection. AltiSurf© systems meet these challenges through multi-technology measurement capability on demanding materials: silicon, glass, resins and polished metals.

Optoelectronics — Variable Optics Components

Characterizing active optical surfaces — lenses, mirrors, variable focal elements — requires nanometric precision. Our instruments measure the shape, flatness and surface condition of these components without contact, preserving their integrity and ensuring reproducible measurements at every inspection.

Optical Networks and Fiber Components

The quality of fiber optic connections depends directly on the polishing geometry of connector end-faces. Altimet enables inspection of flatness, curvature and surface condition of fiber end-faces, with resolution suited to telecom standards requirements (IEC 61300-3-35).

Diffraction Gratings — Profile and Grating Pitch

Diffraction gratings are critical components in spectroscopy, telecommunications and imaging. Precise measurement of their profile — groove depth, pitch regularity, flank symmetry — is essential to validate optical efficiency. Our systems provide complete 3D topography of the grating structure.

Accelerometer Platforms — MEMS Inspection

MEMS sensors (micro-electromechanical systems) integrate very small mechanical structures whose geometry directly determines their performance. Altimet measures platform flatness, layer thicknesses and dimensional deviations of mobile structures, contributing to qualification and production monitoring of inertial sensors.

Wafer Bonding — Flatness and Assembly Quality

Direct wafer bonding requires surfaces of exceptional flatness and cleanliness. Even nanometric topographic variations can compromise bonding quality. Altimet characterizes global and local wafer flatness before and after bonding, enabling detection of assembly defects and optimization of process parameters.

Silicon Fluidic Channels — Microfluidics

Fabrication of fluidic channels on silicon substrates is at the heart of microfluidic and Lab-on-chip technologies. Controlling the depth, width and regularity of etched channels is essential to guarantee device hydraulic performance. Our instruments precisely measure the 3D geometry of these microstructures, including on transparent or semi-transparent substrates.